Future Bridge - 9th High-Density AI Data Center Cooling & Thermal Management Summit
About this event
Two-day operator-focused summit on high-density cooling and thermal management for AI workloads, addressing CDU failures, commissioning delays, retrofits, cooling under ERCOT grid stress, and heat rejection bottlenecks. Co-located with Time-to-Power Summit.
Session topics & tracks
Real-World Deployment & Performance Gaps (CDU failures, commissioning); Cooling Systems Under Stress (transient load, control limits); Retrofitting Legacy Facilities; Operating in Extreme Conditions; Heat Rejection Bottlenecks; Power Meets Cooling (ERCOT constraints).
Speakers
Senior leaders from Fluor Corporation, Stream Data Centers, T5 Data Centers, ARCO Murray, Stack Infrastructure, Ascenty, Rowan Digital, Microsoft, Crusoe.
Sponsors & partners
Presenting Partner: Aalberts. Premier Networking: NUPI Industrie. Gold: Allegheny Surface Technology. Bronze: Smart Cooling, Viega. Exhibiting Partners: Condair, Xylem, WARE, WeInstall, Horizon Roofing, Rice Brothers.
Who should attend
C-Level, VPs, and Directors owning data center operations and cooling; operators, cooling solution providers, HVAC/thermal specialists, GPU manufacturers, energy efficiency firms.